Skip to main content
Why Switch to Altium
See why and how to switch to Altium from other PCB design tools
For Parts and Data
资源 & 支持中心
资源 & 支持中心
Professional Training / Certification
University / College
Secondary / High School
Main Chinese menu
探索即将发布的Altium Designer 24
Common PCB Assembly Defects You Should Know
In this Blog, Tara gives a list of the most common assembly defects, some that PCB design can influence and some that are related specifically to the assembly process itself.
Rigid-Flex PCBs: Advantages and Challenges
Rigid-flex PCB technology merges rigid boards' stability with flexible circuits' flexibility. Read this article to learn about Rigid-flex PCB technology's advantages of space efficiency, reliability, durability, and complexities associated with bend radius considerations, material selection, and challenges related to signal integrity. The successful design of rigid-flex PCBs requires collaboration, thorough testing, and meticulous planning.
Navigating the Bend and Fold in Flexible Circuit Design
In this informative article, Tara Dunn looks at the advantages of utilizing flexible circuits in electronic design, with a specific focus on their ability to be bent and folded. Mentioned are essential factors to consider when designing flexible circuits that can withstand folding without compromising functionality and reliability.
Common Flex Design Mistakes and How to Fix Them
The ability to bend, flex and fold are one of the primary benefits of flexible circuit materials and while there are several examples of flexible circuit designs that withstand hundreds of thousands of even millions of flexes, the reality is that designs that are dynamically flexing often have had the design updated many times before reaching optimal performance. The good news for designers new to flexible circuit designs is that most flexible
Fabrication Notes: Communicate Clearly
Fabrication Notes: Communicate Clearly What is the number one thing that can be done to ensure first pass success on your flex or rigid flex design? If the first word that comes to mind is COMMUNICATION I couldn’t agree more. Although the “basics” of flexible circuit design are not all that different than a rigid printed circuit board, the devil is in the details as they say. There are a number of subtle differences that will help ensure your
Flexible Circuits: Start with the Basics
There are several advantages to using flexible materials. Size, weight, the ability to bend around corners and to flex during use to name just a few. Read this blog to learn more!
Amplified Benefits: Flexible Circuits with Ultra-HDI conductors
Sometimes 2 + 2 does NOT equal 4, sometimes the combination of two technologies can amplify the benefits of both to something far greater. Today’s blog is going to shine a light on the combination of using both flexible materials and ultra-HDI feature sizes, specifically, trace and space that is less than 50 microns and in fact is now being produced in the United States with 20-micron trace and space using traditional printed circuit board
Ultra HDI - More Frequently Asked Questions
What is Ultra-HDI? There is a lot of conversation about “Ultra-HDI” especially with all of the anticipated work being done as part of the CHIPS Act. In my experience, Ultra-HDI means different things to different people depending on where their capabilities and expertise are. IPC has created a working group to address ultra-HDI and their position is that to be considered ultra-HDI, a design needs to include one or more of the following parameters
Flex Circuit Miniaturization and Biocompatibility with SAP Processes
Fabricators typically purchase flexible laminate, which consists of a layer of rolled annealed or electro-deposited copper on one of both sides of the dielectric. The most common dielectrics are polyimide, LCP, and polyester.
What Are Ultra HDI and Package Substrates?
Tara Dunn interviews Mike Vinson, COO of Averatek, to discuss the Ultra HDI and package substrate market.
Capabilities for Ultra-High-Density PCB
Printed circuit board designers have an exciting new tool to use to help solve complicated routing challenges. Fabricators serving the low to medium-volume, high-mix markets are now offering Ultra-HDI technology, fabricating circuit layers with semi-additive processes. This gives PCB designers a number of key benefits: the ability to route with 25-micron trace and space with highly precise traces, the ability to use larger feature sizes with
Ultra-HDI Technology is Not New
A-SAP™ and mSAP have been used in the electronics industry for a long time. Tara Dunn talks about the transition of the semiconductor and super high volume PCB market to medium volume applications. Read now to learn more.
Cost Comparison: Subtractive vs. Semi-Additive
Expert Tara Dunn discusses the significant benefit of the 3D additive manufacturing process in space savings associated with routing at 15 or 25 microns compared to the standard 75 microns. Read now and learn more about cost comparison with the subtractive process.
SAP: PCB Reliability Beyond Test Results
Expert Tara Dunn explores options that are more qualitative than D-Coupon and IST testing that will improve micro via reliability or reliability in general terms by making the printed circuit board easier to manufacture. Read this blog to learn more.
SAP Reliability Data
How reliable are PCBs manufactured through SAP? In this article, Tara Dunn discusses PCB reliability criteria, which includes: D-Coupons, IST Coupons, peel strength testing, and SIR testing. Read to learn more.
SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up
This blog addresses commonly asked questions related to circuit layer stack up in relation to the new technology of SAP (Semi-Additive PCB Process).
A-SAP™ – What do you need to know?
Semi-additive process or SAP allows the ability to design with, and manufacture a 15-micron trace and space repeatedly and reliably. Read more about this great option and opportunity previously not available to PCB designers and PCB fabricators.