How Does Epoxy Fill Affect Peel Strength?

Created: August 6, 2019
Updated: March 16, 2020

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What Goes Into Rugged Electronics Design? In this article, we’ll outline some of the common design decisions that go into rugged electronics, as well as some steps you can take to create rugged PCBAs. Read Article

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New Dimensions of PCB Simulation Judy Warner: What was the technology impetus behind forming Avishtech as a company? Keshav Amla: The simple answer is that we saw some major pain points in the existing electronics design and development approach, relating to signal integrity, manufacturability and reliability of PCBs. As far as signal integrity, loss modeling was a source of major consternation, but an even bigger cause for concern was the inability to predict manufacturability Read Article

How to Speed Up Your DFM Report Process in the Cloud Make sure your design will be produced with high quality and yield with our DFM analysis guidelines. You’ll want to perform DFM analysis at multiple stages during the design process. Read Article

Antipad Diameter, Crosstalk, and IBM’s Results from IPC APEX EXPO 2021 Interlayer crosstalk begins with antipad diameters, and IBM’s results help us see how antipad diameter on back-drilled PTHs affect signal integrity. Read Article

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