Jay Colognori on Working with New Materials

Created: October 16, 2018
Updated: March 16, 2020

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Design Basics for HDI and the HDI PCB Manufacturing Process As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect (HDI) techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer^® can help you create Read Article

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OnTrack Newsletter: Altium and IPC form Partnership, Fab Notes and Food for your Brain - November 2021 November 2021 VOL. 5 No. 5 Full Article | Watch Video | Brain Food IPC joins Altium as Newest Nexar Ecosystem Partner Recently IPC and Altium formally announced that IPC is joining the growing body of the Nexar ecosystem. In this interview, we talk to David Bergman, VP of standards and technology at IPC. He talks about how he thinks this new partnership will bring bi-directional value to both organizations. Read Full Article What's In PCB Read Article

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