PCB Layout: Pads & Vias

Articles and resources related to PCB Layout: Pads & Vias. Check out Altium.com to learn more about PCB Layout and other relevant topics.

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Simulation Driven PCB Design

Simulation Driven Design Can Solve Your PCB’s Signal Problems and More 9 min Blog Simulation Engineers

Simulation Engineers

Simulation Engineers

Simulation Engineers If you work in the electronics industry or in research, there’s a chance that simulations are a regular part of

Stitching Vias

Everything You Need to Know About Stitching Vias 12 min Blog Stitching vias are more than just periodic via arrays, they provide groups of net connections across layers that are needed in power, RF, high-speed, and more.

IPC 4761 Via Type

IPC-4761 Via Types 6 min Guide Books The document describes the possibilities of supporting several types of adapter protection according to the standardized IPC-4761 via types in Altium with the advantages and disadvantages of each.

Meeting Standards: IPC 6012 Class 3 Via Sizes and Annular Rings

Meeting Standards: IPC 6012 Class 3 Via Sizes and Annular Rings 10 min Thought Leadership Take a look at the above image of a PCB layout, specifically the vias and drill holes poking through the

PDS Impedance: The Traditional Approach To PDS Design vs. Energy Flow

PDS Impedance: The Traditional Approach To PDS Design vs. Energy Flow 11 min Blog Take a look at traditional PDS impedance versus the “energy flow” view of PDS design. We’ll debunk misleading information that could cause your designs to fail.

Making the Most of Your Crystal Oscillator

Making the Most of Your Crystal Oscillator 18 min Blog “Blindly” adopting what a crystal oscillator data sheet says usually results in adequate frequency stability. An oscillator requires the phase shift around the loop to be 360° and this total phase shift must be a precise and stable oscillation frequency.

When Should You Use a Flex Circuit?

When Should You Use Flexible Printed Circuit Cables? 5 min Blog The two predominant reasons for using flex or rigid flex, are to solve a packaging issue or reduce the space and weight of the electronics package. These two are often interrelated and space, weight and packaging, (SWaP) will continue to be a driving force in PCB design.