Expert PCB Design Advice from the Pros: OnTrack Newsletter July 2017

September 12, 2017 Judy Warner
 
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On Track Newsletter
July 2017 VOL. 1 No 4
 

Welcome to the July edition of Altium’s On Track newsletter. In Rock Stars and Superheroes we continue with part two of our conversation with signal integrity guru Rick Hartley, who shares some timeless wisdom for today’s EE and PCB designer.

In Maker Space, you will enjoy learning about team Badgerloop from the University of Wisconsin. These undergrad underdogs are just weeks away from their 2nd SpaceX Hyperloop Pod competition, with a lightning-fast new pod. We’ve also included some great Brain Food to help keep your PCB design knowledge and skills razor sharp.

Upcoming trade events include our very own AltiumLive 2017: Annual PCB Design Summit that will be taking place in North America and Europe this October! Be sure to reserve your spot. If you have something compelling to share with fellow designers, be sure to submit your idea on our call for presentations page.

Enjoy and stay On Track!

Judy M. Warner
Director of Community Engagement
 
 
 
Spotlighting Exceptional PCB Designers
 
Last month, SI guru Rick Hartley shared his history and experiences as an EE and PCB design professional. In part two of this interview, Hartley shares three key pieces of practical advice for today’s design professional that has been drawn from a long and illustrious career spanning over 30 years...and counting!
 
 
 
Badgerloop’s Run for Hyperloop Glory
 
A few months ago I saw a tweet from the University of Wisconsin’s Badgerloop Team, a student engineering team that Altium sponsors for the SpaceX Hyperloop Pod competition. My jaw dropped when I saw a photo of Elon Musk sitting inside their pod during the competition in January. I decided to reach out to the electrical team lead, Ryan Castle, to find out more about this team and how they managed to capture the interest of Musk.
 
 
 
Flex and Rigid-Flex Tips
 
Altium FAE John Magyar discusses design considerations relative to cost, board shape, stackup, routing and vias on flex and rigid-flex circuits.
 
 
 
 
 

About the Author

Judy Warner

Judy Warner has held a unique variety of roles in the electronics industry since 1984. She has a deep background in PCB Manufacturing, RF and Microwave PCBs and Contract Manufacturing with a focus on Mil/Aero applications in technical sales and marketing. She has been a blogger, writer, contributor and journalist for several industry publications such as Microwave Journal, The PCB Magazine, The PCB Design Magazine, PDCF&A and IEEE Microwave Magazine and is an active member of multiple IPC Designers Council chapters. In March 2017, Warner became the Director of Community Engagement for Altium and was immediately tasked with the launch of Altium’s monthly On Track Newsletter. She was also instrumental in launching AltiumLive 2017: Annual PCB Design Summit in San Diego and Munich, a newly founded annual Altium User Conference. Her passion is providing resources, supporting and advocating for PCB Designers around the world and acting as brand ambassador for Altium.

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