[Live Webinar - Altium Designer 20.1] 6 Reasons to Switch Design Tools

| Created: May 19, 2020 | Updated: March 22, 2021

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Pin-Package Delay and Via Delay in High Speed Length Tuning Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different Read Article

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[Live Webinar - Altium Designer 20.1] 6 Reasons to Switch Design Tools

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