Optimizing Layer Stackup and Impedance for High-Speed PCB Design
In today’s high-speed PCB designs, increased transmission lines, clock frequencies, and data rates pose significant challenges. Neglecting these factors can affect performance, power consumption, and compliance. Learn how to tackle these issues with Altium Designer by mastering the layer stack manager to efficiently create stackups, manage materials, and ensure optimal design performance.
Attend this live webinar covering the following:
- Current trends in electronics development
- Stackup definition and material selection for the design
- PCB transmission line model and impedance calculations
- Defining impedance profiles
- High-Speed Rules definition
- Advanced Routing to meet design needs
Author
Author
Kunjal studied Electronic & Communication Engineering at university, and currently works as a Technical Application Engineer at Altium in the Altium Bangalore office in India. Kunjal has over 20 years of direct experience with IPC CID Certification as an Sr. PCB Designer in the Space industry, various design firms, PCB Fabrication, and assembly houses.
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Optimizing Layer Stackup and Impedance for High-Speed PCB Design
Created: March 4, 2025
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In today’s high-speed PCB designs, increased transmission lines, clock frequencies, and data rates pose significant challenges. Neglecting these factors can affect performance, power consumption, and compliance. Learn how to tackle these issues with Altium Designer by mastering the layer stack manager to efficiently create stackups, manage materials, and ensure optimal design performance.
Attend this live webinar covering the following:
- Current trends in electronics development
- Stackup definition and material selection for the design
- PCB transmission line model and impedance calculations
- Defining impedance profiles
- High-Speed Rules definition
- Advanced Routing to meet design needs
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