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Optimizing Layer Stackup and Impedance for High-Speed PCB Design

In today’s high-speed PCB designs, increased transmission lines, clock frequencies, and data rates pose significant challenges. Neglecting these factors can affect performance, power consumption, and compliance. Learn how to tackle these issues with Altium Designer by mastering the layer stack manager to efficiently create stackups, manage materials, and ensure optimal design performance.

Attend this live webinar covering the following:

Current trends in electronics development
Stackup definition and material selection for the design
PCB transmission line model and impedance calculations
Defining impedance profiles
High-Speed Rules definition
Advanced Routing to meet design needs

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Optimizing Layer Stackup and Impedance for High-Speed PCB Design

Created: March 4, 2025

At a Glance

Learn how to master the layer stack manager to efficiently create stackups, manage materials, and ensure optimal design performance.

1 video

Hosted by Kunjal Patel - Field Application Engineer

01:01:18 • Mar 27, 2025

Hosted by Kunjal Patel - Field Application Engineer

01:01:18 • Mar 27, 2025

Learn how to master the layer stack manager to efficiently create stackups, manage materials, and ensure optimal design performance.

Product: Altium Designer Webinars Electrical Engineers High-Speed Design PCB Design and Layout

Attend this live webinar covering the following:

Current trends in electronics development
Stackup definition and material selection for the design
PCB transmission line model and impedance calculations
Defining impedance profiles
High-Speed Rules definition
Advanced Routing to meet design needs

Author

Kunjal studied Electronic & Communication Engineering at university, and currently works as a Technical Application Engineer at Altium in the Altium Bangalore office in India. Kunjal has over 20 years of direct experience with IPC CID Certification as an Sr. PCB Designer in the Space industry, various design firms, PCB Fabrication, and assembly houses.