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ROHM's R&D facilities integrate EMC testing, motor bench evaluation, and advanced simulation to tackle electromagnetic noise, efficiency, and thermal challenges. Together, they create a preventive validation ecosystem that accelerates development and ensures reliable, compliant electronic systems.
Define the right specs for SiC and GaN power stages. Learn how to control switching behavior, isolation, sensing, magnetics, and layout for a clean first spin.
Explore board‑level trends shaping wide‑bandgap power. Learn how SiC and GaN impact layout, EMI, isolation, sensing, and packaging for next‑generation designs.
Design 224G channels with the right connectors and flyover cables. Plan for shorter reach. Keep serviceability in view.
Plan connector choices earlier in the design. See 2026 trends in bandwidth, power density, and sustainability.
Design smarter MCUs. Size for WLCSP, plan Thread/Matter, secure OTA, and pick toolchains that cut bring-up. Get clear guidance on what to spec.
Discover silicon breakthroughs in MCUs, connectivity, power, and imaging; higher capability in smaller, cooler footprints with credible roadmaps and availability.