Via Structures: Designing for Reliability, Not Just Density
PCB Design Engineers
Manufacturing Engineers
Electrical EngineersLet’s face it, when it comes to via structures in printed circuit board design, it’s easy to get lost in the jargon. Stacked vias, staggered vias, filled vias, via-in-pad, blind vias, buried vias... The list goes on. With all the focus on miniaturization and high-density designs, it’s tempting to default to the smallest, most compact option. But here’s the reality: if your via structure isn’t chosen with reliability and manufacturability in mind...