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Ten 32-bit MCUs Powering Next-Gen Embedded Systems
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Ten 32-bit MCUs Powering Next-Gen Embedded Systems

7 min
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In 1974, Texas Instruments released the TMS1000, the first commercially available microcontroller (MCU). This groundbreaking (for its time) component combined a 4-bit CPU, 1 KB ROM, 256-bit RAM and input/output lines, all on a single chip. Today, a high-performance 32-bit MCU sporting 2MB of on-chip SRAM can reach speeds of 1 GHz, running at least 2,500 times faster than the pioneering TMS1000.  Microcontrollers have evolved from simple...
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Advanced Security Features in Modern 32-bit MCUs
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Advanced Security Features in Modern 32-bit MCUs

6 min
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The rapid proliferation of connected devices has substantively changed the security landscape for embedded systems. Modern 32-bit microcontrollers (MCUs) now serve as the first line of defense against an increasingly sophisticated array of security threats, from device cloning and firmware tampering to side-channel attacks that exploit subtle variations in power consumption or electromagnetic emissions. This evolution has driven MCU manufacturers...
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Semiconductor Sales Are Up, Silicon Valley Invests in Mexico
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Semiconductor Sales Are Up, Silicon Valley Invests in Mexico

4 min
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Strategies for Boosting Procurement Efficiency in PCB Component Sourcing
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Strategies for Boosting Procurement Efficiency in PCB Component Sourcing

5 min
Blog
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How many times have you uploaded your BOM to a distributor website, only to find that half of the parts can't be procured or will be stuck on backorder? You're not alone if this has happened to you. The industry moves very quickly, and if you're ordering at levels that require you to procure through distributors, you shouldn't be surprised when some items in your BOM go obsolete, reach end-of-life (EOL), or go out of stock. This can all happen...
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How the 600nm Phase-Out Will Impact Legacy Systems
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How the 600nm Phase-Out Will Impact Legacy Systems

14 min
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The semiconductor industry is on the brink of a significant transition as it phases out 600nm wafers. This shift, driven by advancements in technology and the need for more efficient manufacturing processes, will have profound implications for legacy systems that rely on these older nodes. In this article, we will explore the impact of the 600nm phase-out, provide a historical overview of wafer volumes, and discuss the broader context of the...
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Overview of the European NIS2 Directive
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Overview of the European NIS2 Directive

9 min
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NIS2 is a new EU directive you need to pay attention to. While there's no denying that digitalization has made for more efficient internal and external processes, easing the movement of goods and minimizing costs, it's this very reliance on interconnected digital systems that has left manufacturers—and their value chains—vulnerable to an unprecedented level of cybersecurity threats as cybercriminals increasingly target vulnerabilities within the...
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DFARS Compliance Checklist for Electronics Design Teams
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DFARS Compliance Checklist for Electronics Design Teams

7 min
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The Defense Federal Acquisition Regulation Supplement (DFARS) is a set of regulations developed and used by the U.S. Department of Defense (DoD) to govern the acquisition of goods and services; the regulations are designed to make sure that the DoD procures items and services in a way that promotes national security and supports defense objectives. And so, if your company, regardless of industry, has any involvement in supplying the department...
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How to Lead a Successful Requirements Review Process
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How to Lead a Successful Requirements Review Process

6 min
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In electronics design, particularly in PCB (Printed Circuit Board) projects, a robust requirements review process ensures that each project aligns closely with design requirements, client specifications, technical standards, and regulatory guidelines. This process reduces costly engineering change orders and rework, streamlines workflows, and bolsters the chances of first-pass success. Let’s explore how to lead an effective requirements review...
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Backdrill-and-Fill For Blind and Buried Vias in PCBs
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Backdrill-and-Fill For Blind and Buried Vias in PCBs

9 min
Blog
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Blind vias aren’t just for HDI PCBs, they are also used in standard builds with mechanical drilling and no thin outer layers or build-up film layers. These designs find their home in many different systems, and for me this is most common in high-speed designs or RF designs that require terminated holes for press-fit pins or threaded pins. No matter what the application is, the presence of these holes drives a multiple lamination process to drill...
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