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Differential Oscilloscope Probe Project DIY Differential Oscilloscope Probe Project Do you need a differential probe for your oscilloscope? Join Mark Harris designing a DIY differential probe, and exploring the advantages of using a differential probe for testing your circuit. Read Article
Pros and Cons of Advanced Electronic Packaging for PCB Designers Pros and Cons of Advanced Electronic Packaging for PCB Designers Our guest Phil Marcoux is very well-known in the advanced electronic packaging community and currently working as a business mentor in the electronics industry. Today we will tackle the pros and cons of heterogeneous electronic assemblies and what we can do as an industry to move forward with it. Read Article
pcb component warpage causes Component Warpage Causes in a PCB A staff member at a PCB manufacturer once explained to me that they thought we were having an issue with a package warping. Prior to this I had assumed that this was highly unlikely in standard component packages used in a PCBA. Unfortunately, component warping can occur both in a PCB and in components. Mechanical mishandling leading to bending is an obvious one, but there are potentially other problems that could cause component warpage without Read Article
bga fanout pcb routing Which BGA Pad and Fanout Strategy is Right for Your PCB? Your BGA fanout strategy depends on the BGA pad size and your pin density. Learn how to pair the right BGA pad size with PCB trace width in this article. Read Article
ADC Ground How to Properly Ground ADCs Grounding with an ADC will influence noise injection into the board and it should be dealt with carefully when building a mixed-signal system. Read Article
Cutting Edge Technology in Packaging with an Interposer Cutting Edge Technology in Packaging with an Interposer In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International. Read Article
Plated Through-Hole Vias in mmWave PCBs Plated Through-Hole Vias in mmWave PCBs Plated through-hole vias in mmWave PCBs can ruin signal integrity in your RF interconnects if not implemented properly. Learn how to size and place stitching vias in this article. Read Article
virtual array calculation How to Calculate a Virtual Array in MIMO Systems RF and sensing systems that use MIMO functionality have some important design constraints concerning virtual antenna design and placement. In these systems, due to the need for finer resolution and higher transmit/receive gain, the trend has been to pack more antennas into an array for beamforming and the reception of low-level signals. There is a reason for this trend, and it relates to an important concept in antenna array systems. When Read Article
Maximum Usage to Improve Supply Chain Resiliency Maximum Usage to Improve Supply Chain Resiliency Supply chain resilience increases, and electronic design productivity improves when prioritizing components' maximum usage in thoughtful tactical and strategic perspectives. Read Article
Footprint Creation Made Easy Footprint Creation Made Easy Learn how to create footprint with ease using the IPC Compliant Footprint Wizard, built-in to Altium Designer. In this guide, you’ll learn how to quickly create an example SOIC-8 footprint, including automatic generation of an accurate 3D model. Read Article
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