Multi-Layer PCBs & Layer Stackup

Browse our library of resources to learn more about multi-layer PCB design & layer stackup

SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up In a previous blog post, we took a 10,000-foot view and went through a basic introduction to SAP. This Semi-Additive Process is an additional tool in the PCB fabricators toolbox that enables them to provide features sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit Read Article

Hybrid PCB Stackup Reliability

How Reliable is Your Hybrid PCB Stackup? Do you know whether your hybrid PCB stackup is reliable? What can your fabricator do to help ensure reliability? Read this article to learn more. Read Article

6-Layer PCB Design

6-Layer PCB Design Guidelines | PCB Design 6-layer PCB design guidelines are easy to follow when you use the right design software. Read Article

2+N+2 PCB stackup

2+N+2 PCB Stackup Design for HDI Boards A 2+N+2 PCB stackup is one of the standard options for building a high density circuit board. Learn more about these stackups for HDI PCBs. Read Article

Version Control for Hardware, Layer Stackup in Web Viewer, and SOC 2 Type 1 Certification

What’s New in Altium 365: Version Control for Hardware, Layer Stackup in Web Viewer, and SOC 2 Type 1 Certification The Altium 365 user community is now 20,000 strong! Recent updates include layer stack web viewer, SOC 2 Type 1 certification, and more. read all about it here. Read Article

Flex PCB materials

Introduction to Flex PCB Materials Learn how to properly select flex PCB materials for accommodating rigid-flex designs and how choosing the right flex circuit materials helps mitigate field-failures. Read Article

Stripline impedance calculator

Stripline Impedance Calculator Learn more about using and interpreting results from a microstrip impedance calculator. Read Article

Microstrip impedance calculator

Microstrip Impedance Calculator Learn more about using and interpreting results from a microstrip impedance calculator. Read Article

Differential stripline impedance calculator

Differential Stripline Impedance Calculator Try our differential stripline impedance calculator, built based on Wadell’s equations. Read Article

Differential Microstrip Impedance Calculator

Differential Microstrip Impedance Calculator Learn more about using and interpreting results from a differential microstrip impedance calculator. Read Article

Power plane resonances PCB

When Do PCB Power Plane Resonances Occur? Do you know when a power plane resonance occurs in the PDN on a circuit board? We’ll examine when this occurs and what causes it. Read Article

Reduce copper losses

Recover Conductor Losses By Clearing Your PCB Ground Layer Need to recover some conductor losses? Here’s how clearing out your ground plane near an I/O or connector can help. Read Article

Star ground PCB

What is PCB Star Grounding and Why Would Anyone Use It? PCB star grounding can encourage bad design practices that lead to radiated EMI emissions in your PCB layout. Read Article

1 oz copper weight

Do You Always Need 1 oz. Copper Thickness on Each Layer? 1 oz. copper thickness is often seen as a standard thickness value used in many designs. Here’s when you might need thicker copper on every layer. Read Article

2-layer PCB Routing

Can You Route Digital Signals on a 2-layer PCB? 2-layer PCBs are a common entry-level choice for designers, and they can even support high speed designs if built correctly. Read Article

4 Layer PCB Stackup

Two Alternative 4 Layer PCB Stackups With 50 Ohms Impedance Need a 4-layer PCB stackup that can support high speed components on both sides of the board? Consider these alternatives to the typical 4-layer stackup. Read Article

microstrip to ground clearance

Microstrip Ground Clearance Part 2: How Clearance Affects Losses In a previous article, I provided a discussion and some simulation results on the necessary clearance between impedance controlled traces and nearby grounded copper pour. What we found was that, once the spacing between the pour and the trace becomes too small, the trace becomes an impedance-controlled coplanar waveguide (with or without ground). We also saw that the 3W rule for the spacing between the trace and the grounded copper pour is a bit Read Article