Fabrication and Assembly

Browse our library of resources to learn more about pcb design and circuit board fabrication and assembly.

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Types of PCB soldering

Types of PCB Soldering and the Assembly Process 7 min Blog Manufacturing Engineers

Manufacturing Engineers

Manufacturing Engineers

Manufacturing Engineers There are multiple types of PCB soldering used in assembly, learn more about these types of solder and processes used to apply them.

Double-sided PCB soldering

Best Design Practices for Double-Sided PCB Reflow Soldering with SMD Parts 7 min Blog Read our guidelines for designers who want to ensure successful double-sided PCB soldering.

Developing a PCB Testing Procedure For New Designs

Developing a PCB Testing Procedure For New Designs 9 min Blog Before your new device comes off the fabrication line, it will need to go through a comprehensive PCB testing procedure. Here’s how to create a PCB testing procedure for new boards.

When Should You Use a Flex Circuit?

When Should You Use Flexible Printed Circuit Cables? 5 min Blog The two predominant reasons for using flex or rigid flex, are to solve a packaging issue or reduce the space and weight of the electronics package. These two are often interrelated and space, weight and packaging, (SWaP) will continue to be a driving force in PCB design.

How to Choose the Best PCB Manufacturer for Your Project

How to Choose the Best PCB Manufacturer for Your Project 5 min Blog Here’s how you can find and qualify the best PCB manufacturer for your new product.

PCB manufacturing trends interview

PCB Manufacturer Trends and Challenges with Summit Interconnect 19 min Thought Leadership Learn more about PCB manufacturing trends from Clay Swain, Senior Vice President of Sales and Marketing, and Gerry Partida, Senior Field Applications Engineer.

An Overview Of PCB Outer Layer Processing

An Overview Of PCB Outer Layer Processing 5 min Thought Leadership Expert Kella Knack describes in detail the fabrication of the PCB outer layer. Read and learn about how different vias are formed and the steps involved in the multilayer build-up process.