PADS to Altium Designer Migration - Creating and Using Rooms

Created: September 9, 2019
Updated: March 16, 2020

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FPGA PCB layout

How to Start an FPGA PCB Layout For Your Embedded System FPGAs are key elements that aid innovation in advanced embedded systems where ready-made SoCs may not be available. See why you should use an FPGA in your embedded system. Read Article

ground below inductor

Should Ground Be Placed Below Inductors in Switching Regulators? Should you place a ground cutout beneath the inductor in a switching regulator PCB layout? This is an important question surrounding EMI/EMC, and we’ll investigate in this article. Read Article

Switching regulator layout

Switching Regulator Layout: One or Two Layers? Don’t be afraid to route your switching regulator layout on two layers, but be careful of these noise problems if you do! Read Article

PCB Solder mask expansion

What Solder Mask Expansion Value Should You Use? The solder stop mask layer caps off the PCB and provides a protective film over copper on the surface layers. Solder mask needs to be pulled back from landing pads on the surface layer so that you have a surface where components can be mounted and soldered. This removal of the solder mask from a pad on the top layer should extend some distance around the edge of the pad, creating either NSMD or SMD pads for your components. How far back should Read Article

Parasitic capacitance

How to Reduce Parasitic Capacitance in a PCB Layout Learn how to reduce parasitic capacitance so you can prevent high-frequency noise coupling in your PCB layout. Read Article

tented vias

When to Use Tented Vias in Your PCB Layout Some designers swear by tented vias and prefer to always use them. When should these be used and when should they be avoided? We’ll explore in this article. Read Article

PCB test points

Is It Printed or a Component? All About PCB Test Points A PCB test point can be a simple pad in the PCB layout, or it can be a specific component where you can connect a probe. Read Article

The Semi-Additive Process (SAP) PCB – Burning Questions

The Semi-Additive Process (SAP) PCB – Burning Questions Semi-Additive Process (SAP) is an additional tool in the PCB fabricators toolbox that supports low volume, high mix applications. Read this article to see the detailed process on how SAP works and how it can be applicable to your next SAP PCB design. Read Article

copper pour and via stitching

Copper Pour and Via Stitching: Do You Need Them in a PCB Layout? When is it appropriate to use copper pour or via stitching in your PCB layout? Read our guide on copper pour and how it can be used properly with via stitching. Read Article

Star ground PCB

What is PCB Star Grounding and Why Would Anyone Use It? PCB star grounding can encourage bad design practices that lead to radiated EMI emissions in your PCB layout. Read Article

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