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Robotic Vision Systems AI Inference in Robotic Vision with Luxonis Erik Kokalj, director of application engineering at Luxonis, and Bradley Dillon, CEO of Luxonis discuss how and who can benefit from AI technology. Read Article
Flex Circuit Miniaturization and Biocompatibility with SAP Processes Flex Circuit Miniaturization and Biocompatibility with SAP Processes Fabricators typically purchase flexible laminate, which consists of a layer of rolled annealed or electro-deposited copper on one of both sides of the dielectric. The most common dielectrics are polyimide, LCP, and polyester. Read Article
PCB power integrity The Beginner's Guide to PCB Power Integrity: From Board to Package In this article, we give a complete overview of power integrity, starting from the PCB and including everything up to packaging. Read Article
Expert Tips for Safely Powering Up Your New PCB for the First Time Expert Tips for Safely Powering Up Your New PCB for the First Time In this blog by expert Mark Harris, you will learn about the strategies to minimize the risk of damage to circuit boards during the initial power-up process. Read it now! Read Article
What Are Ultra HDI and Package Substrates What Are Ultra HDI and Package Substrates? Tara Dunn interviews Mike Vinson, COO of Averatek, to discuss the Ultra HDI and package substrate market. Read Article
IC Carrier PCB How to Design an IC Carrier PCB Carrier boards for integrated circuits can be used as interposers whenever there is an incorrect PCB land pattern. Read Article
What is Printed Electronics? The True Benefits of Printed Electronics Listen to the podcast and explore the benefits of Printed Electronics, from faster prototyping and proof of concept to advancements in academic research. Read Article
ADC PCB layout Dual ADC Module PCB Design Project ADCs in a PCB are examined in this project, including placement and routing involving an isolated ADC. Read Article
Resilient and Secure Domestic Supply Chain Resilient and Secure Domestic Supply Chain Travis Kelly, President, and CEO of Isola group returns to continue the conversation on the CHIPS Act. Read Article
Ultra-HDI Technology Capabilities for Ultra-High-Density PCB Printed circuit board designers have an exciting new tool to use to help solve complicated routing challenges. Fabricators serving the low to medium-volume, high-mix markets are now offering Ultra-HDI technology, fabricating circuit layers with semi-additive processes. This gives PCB designers a number of key benefits: the ability to route with 25-micron trace and space with highly precise traces, the ability to use larger feature sizes with Read Article
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