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Advantages of Flexible Circuits for Space Applications Advantages of Flexible Circuits for Space Applications Flexible circuits reduce weight in spacecraft and can be used in enclosures where there is minimal available space. Read Article
PCB Outgassing How to Prepare Your PCB for Outgassing in Ultra-High Vacuum Systems Outgassing from a PCB can occur during assembly, at high temperature, and in high vacuum. Make sure you follow these guidelines to reduce outgassing. Read Article
Substrate-Like PCBs Substrate-Like PCBs Push the Limits of HDI A substrate-like PCB looks similar to an HDI PCB and similar to an IC substrate. Read this article to learn about substrate-like PCBs. Read Article
OnTrack Podcast 2022 Year in Review OnTrack Podcast 2022 Year in Review The Altium OnTrack Podcast covered a year of rapid changes in 2022. In this year in review video, host Zach Peterson revisits some moments from long-time and returning guests in 2022. Topics include PCB packaging, supply chain issues, The CHIPS Act, and much more. Read Article
MIMO Antenna Design MIMO Antenna Design and PCB Layout Tips Advanced products operating in the RF domain are increasingly using MIMO antenna arrays to provide high data throughput and serve multiple end users. Read Article
How to Design High-Speed & RF Via Transitions How to Design High-Speed & RF Via Transitions High speed PCBs and RF PCBs often need to make via transitions that carry signals between layers. We’ll look at how to design these transitions in this article. Read Article
Product Design Features in Altium Designer 23 Product Design in Altium Designer 23 December 9, 2022 ONTRACK BI-WEEKLY Product Design Features in Altium Designer 23 When you work on a product, you don’t just build boards. PCB designers have to work as part of a team to bring advanced products to market. The newest set of features in the upcoming release of Altium Designer 23 focuses on product design, spanning from ECAD to MCAD in multi-board systems with harnesses. New harness design tools - It is now possible to develop full Read Article
Embedded AI The Path Forward for Embedded AI In April 2021, I published an article in Printed Circuit Design & Fab, where I proclaimed the future of AI is embedded. In short, my view is that embedded systems will leverage greater usage of AI on the end device, meaning they will rely less on cloud platforms or data centers for inference. Without a doubt, I believe the future of AI is still embedded, but not with the chipset or system architecture I would have thought. At the time of writing Read Article
Chip-on-Board PCB Design Rules for Chip-on-Board Layout There is one simple type of packaging that is not really packaging in the conventional sense: chip-on-board. Read Article
package PDN How Does the Package PDN Impact Power Integrity? Component packages have their own power distribution network (PDN) that influences their operation and drives compensation in the PCB. Read Article
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