| Created: December 13, 2022
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Updated: January 29, 2023
November 25, 2022
ONTRACK BI-WEEKLY
Coming Soon in
Altium Designer 23
Experience more advanced design tools, product design features, and expanded collaboration in the upcoming release of Altium Designer 23.
Product Design Features - The upgraded multi-board design features include harness creation, multi-board support in CoDesigner, placement of cloud components in multi-board projects, and multi-board support in the Altium 365 viewer.
Greater Collaboration - The collaboration tools available through Altium 365 will extend into other areas of Altium Designer. Comments will be available in ActiveBOM and Draftsman, and Pro users can create tasks based on comments.
Advanced Layout Tools - Users will have more control over PCB layouts with custom pad shapes in footprints, streamlined design rule creation, and simplified variant management.
We’ll continue to update users on these new capabilities as the release date approaches, and be sure to check the What’s New page to learn about all the latest updates to Altium Designer. When you’re ready to upgrade, navigate to the Updates page from the Extensions and Updates window to install the latest version.
A stackup for a high-speed PCB contains many competing requirements, and it might motivate the use of more advanced materials to hit performance targets. Read more about designing these stackups and how to balance design constraints.
The ULPI interface in a USB HS PHY is examined in this article. Get an intro to the routing practices for this interface and how the tools in Altium Designer can be used for standard high-speed design practices.
Want to get started with flex design, but not sure how to build a flex PCB layer stack? Zach shows how these stacks are built and a great example from a flex PCB fabrication house.
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The advanced packaging movement is underway, and PCB designers are uniquely suited to begin operating in this new area of technology. Geoffrey Leads joins Zach on the OnTrack podcast to discuss his thoughts on packaging and materials following the IPC Advanced Packaging Symposium.
