Skip to main content
Mobile menu
Octopart Discover
Altium Develop
Altium Agile
Resources & Support
Free Altium 365 Tools
Gerber Compare
Online PCB Viewer
Resources & Support
Learning Hub
Support Center
Documentation
Webinars
Altium Community
Forum
Bug Crunch
Ideas
Education & Training
Student Lab
Educator Center
Altium Education Curriculum
Altium Professional Training
Search Open
Search
Search Close
Sign In
HDI Design
Main menu
Home
PCB Design
Collaboration
Component Creation
Data Management
Design Outputs
ECAD/MCAD
HDI Design
High Speed Design
Multi-Board
PCB Layout
PCB Routing
PCB Supply Chain
Power Integrity
RF Design
Rigid Flex
Schematic Capture
Signal Integrity
Simulation
Software
Develop
Discover
Agile
Altium 365
Altium Designer
Education
Programs
Altium Academy
Engineering News
Guide Books
Newsletters
Podcasts
Projects
Training Courses
Webinars
Whitepapers
Learning Hub
HDI Design
Next Generation Materials: The Building Blocks of High Speed Design and HDI
Next Generation Materials: The Building Blocks of High Speed Design and HDI
Created: November 18, 2019
Updated: March 16, 2020
PCB Design Software
What is HDI?
How to Setup HDI PCB Design
Advanced HDI Design
Introduction to High Density Interconnects
What's Different in HDI?
The PCB Design Process
Related Resources
Advanced High Density PCB Layout and Design in Altium
HDI design and high density interconnect routing require implementing a specific process in the PCB stackup and design rules. Learn more in this chapter of Happy Holden's guidebook.
Read Article
How to Match PCB Via Types to BGA Pitch
BGA packages come in multiple pitch values, each of which demands a specific via size for fanout routing on the PCB.
Read Article
HDI vs. Ultra HDI: What PCB Designers Must Be Aware of on the Fab Floor
Discover how Ultra HDI reshapes PCB design and manufacturing with new process limits, material challenges, and stricter requirements for reliable production.
Read Article
Increase Component Density in Multilayer PCB Design with Blind Vias
As component density increases, the via strategy usually changes before anything else. Designers can keep shrinking placement spacing and pushing routing into inner layers for a while, but eventually conventional through-hole vias start consuming too much surface area and too many routing channels. That is the point where blind vias start to matter. They are one of several interconnect structures used when package pitch, fanout routing clearance
Read Article
49:50
Practical Applications of Designing With High-Density Interconnect-HDI
Watch Video
Substrate-Like PCBs Push the Limits of HDI
A substrate-like PCB looks similar to an HDI PCB and similar to an IC substrate. Read this article to learn about substrate-like PCBs.
Read Article
Amplified Benefits: Flexible Circuits with Ultra-HDI conductors
Sometimes 2 + 2 does NOT equal 4, sometimes the combination of two technologies can amplify the benefits of both to something far greater. Today’s blog is going to shine a light on the combination of using both flexible materials and ultra-HDI feature sizes, specifically, trace and space that is less than 50 microns and in fact is now being produced in the United States with 20-micron trace and space using traditional printed circuit board
Read Article
Ultra HDI - More Frequently Asked Questions
What is Ultra-HDI? There is a lot of conversation about “Ultra-HDI” especially with all of the anticipated work being done as part of the CHIPS Act. In my experience, Ultra-HDI means different things to different people depending on where their capabilities and expertise are. IPC has created a working group to address ultra-HDI and their position is that to be considered ultra-HDI, a design needs to include one or more of the following parameters
Read Article
What Are Ultra HDI and Package Substrates?
Tara Dunn interviews Mike Vinson, COO of Averatek, to discuss the Ultra HDI and package substrate market.
Read Article
Capabilities for Ultra-High-Density PCB
Printed circuit board designers have an exciting new tool to use to help solve complicated routing challenges. Fabricators serving the low to medium-volume, high-mix markets are now offering Ultra-HDI technology, fabricating circuit layers with semi-additive processes. This gives PCB designers a number of key benefits: the ability to route with 25-micron trace and space with highly precise traces, the ability to use larger feature sizes with
Read Article
Back to Home
Design to Release, Without the Friction
Keep reviews tied to the right version
Reduce handoff confusion and rework
Spot sourcing and release risk earlier
Work solo, share when needed
Get Started
Thank you, you are now subscribed to updates.
Don’t miss updates