Design With Manufacturing: A New View on DFM/DFA

Zachariah Peterson
|  Created: October 28, 2022
Design With Manufacturing: A New View on DFM/DFA

DFM, DFA, and DFT are all acronyms you will hear thrown about by manufacturers and astute designers. PCB manufacturing processes will always dictate important constraints in a design, and it is a designer’s job to ensure the products they create will be manufacturable at the required volume, cost, and quality standards. The old ways of allowing your manufacturer to adjust and tweak products to fit their process is unsuitable for advanced electronics, and more products are solidly falling into the “advanced” category.

To overcome these challenges, designers need more communication with their manufacturing partners at multiple points during the design process. On the front-end, designers should at least be aware of capabilities, factors that could compromise yield, and small points that could cause a design to receive no-bid status. On the back-end, providing allowances for your manufacturer will help ensure they can stay within your performance specs.

In this e-book, composed by Altium in partnership with Sierra Circuits, readers will gain a firsthand look at important DFM, DFA, and DFT guidelines every PCB designer should know. Covered topics include:

  • What to expect during a DFM reporting process before production begins
  • Some basic DFM/DFA guidelines provided by Sierra Circuits
  • How DFT fits within design, assembly, and DFM/DFA
  • How to communicate allowances to a fabrication house with  examples

With a bit of communication with your manufacturer, you can create documentation that helps you quickly get through the DFM reporting and analysis process, while also helping ensure your finished products match your design specs.

Click the PDF above to read more about PCB reliability and testing. You can also read the original, full-length content here:

Complete Guide to DFM Analysis
Preventing Top DFM Errors in Your PCB Design
DFA Guidelines for an Efficient PCB Design
Communicating PCB Layer Stackup Needs to Manufacturers
What Solder Mask Expansion Value Should You Use?
Is It Printed or a Component? All About PCB Test Points


 

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About Author

About Author

Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2000+ technical articles on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee working on technical standards for quantum electronics, and he currently serves on the IEEE P3186 Working Group focused on Port Interface Representing Photonic Signals Using SPICE-class Circuit Simulators.

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