High Density Interconnects - A Design and Manufacturing Guidebook

| Created: August 13, 2019 | Updated: March 6, 2022

Cell phones, GPU cards, medical devices, industrial equipment... the list of possible applications for high density interconnects is long. Electronics have become miniaturized in an effort to pack more functionality into smaller areas. Driven by the miniaturization of semiconductor packaging beginning in the 1990s, PCBs were quickly forced to follow suit, leading to the development of high density interconnect design and manufacturing techniques. DFM considerations in high density interconnect designs drive important aspects of the design and layout process, and implementing these points successfully helps ensure your design will pass quality requirements once the PCB is fabricated.

In this e-book, readers will receive a comprehensive look at the manufacturing process used to fabricate HDI layer stacks, PCBs, and microvia interconnects used to define layer transitions in the PCB stackup. The goal of this ebook is to provide design strategies that help PCB engineers develop highly reliable layer stacks and interconnects, including microvia structures. Covered topics include:

HDI PCB floorplanning and routing
Materials used in HDI PCBs and how they fit into the manufacturing process
How microvia transitions are used in standardized HDI stackups
Evaluation and acceptance of HDI circuit boards

Click the PDF above to read the entire guidebook and to learn about HDI PCB design, beginning from high density interconnect stackup and floorplanning, and ending with DFM considerations for manufacturing, evaluation, quality, and acceptability. You can also read the original, full-length content here:

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What is HDI? How to Setup HDI PCB Design Advanced HDI Design Introduction to High Density Interconnects What's Different in HDI?

About Author

Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2500+ technical articles on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee working on technical standards for quantum electronics, and he currently serves on the IEEE P3186 Working Group focused on Port Interface Representing Photonic Signals Using SPICE-class Circuit Simulators.