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    About Author

    Happy Holden

    Happy Holden is retired from GENTEX Corporation (one of the U.S.'s largest automotive electronics OEM. He was the Chief Technical Officer for the world’s biggest PCB Fabricator-HonHai Precision Industries (Foxconn) in China. Prior to Foxconn, Mr. Holden was the Senior PCB Technologist for Mentor Graphics; he was the Advanced Technology Manager at NanYa/Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. His prior assignments had been as director of PCB R&D and Manufacturing Engineering Manager. While at HP, he managed PCB design, PCB partnerships, and automation software in Taiwan and Hong Kong. Happy has been involved in advanced PCB technologies for over 47 years. He has published chapters on HDI technology in 4 books, as well as his own book, the HDI Handbook, available as a free e-Book at http://hdihandbook.com and de recently completed the 7th Edition of McGraw-Hill's PC Handbook with Clyde Coombs.

    Most Recent Posts

    Figure of Merit: A Way to Score Your Opinions Metrics are data, and statistically backed measures. It is always expedient to base decisions on data and metrics. But what if a metric doesn’t exist? Then you can create the next best measure: the Figure of Merit. The problem with opinions is that they are difficult to defend, and when used in conjunction with producibility, they often they vary from person to person. That is why the Figure of Merit process is so popular. For a small amount of Read Article
    Revisiting Vertical Connection Structures-VECS Part 2 It’s been about one year since I posted a BLOG about the new VeCS Technology (vertical connection structures) invented by Joan Tourné. Since then, Joan has written four papers detailing much more information about his invention. This is a quick update, in case you have not seen or read those papers. He has two more coming up in January 2020, and March 2020 in PCB007. Vertical Conductive Structures-Rethinking Sequential Lamination [1] NEXTGIN Read Article
    The Importance of Having A Modern PCB Manufacturing Data Format I recently posted a BLOG on Altium about the latest eSmart Factory in New Hampshire. Using the latest in State-of-the-Art machinery and processes, it can produce near-perfect complex multilayers and HDI substrates with extremely fine geometries in only a few days, and without ever being helped or touched by human hands, all while and emitting nothing to harm the environment—zero effluents. Digitization for the Smart Factory This technology will Read Article
    The eSmart Factory Comes to PCB Fabrication We all talk about the Industrial Revolution. The world has gone through a number of “Industrial Revolutions” since the creation of steam power in England. In fact, we talk about three such revolutions since that first one. In the early 2010s, the German Government proposed a fourth industrial revolution they called INDUSTRU 4.0. Today we also call it “The Smart Factory”! But, to date, there hasn’t been too much reported progress in this program Read Article
    Calculating your Fabrication Capability Coefficients People have long asked me, “How do you know if a fabricator is capable of manufacturing my boards?” First, I tell them to ask for an IPC PCQR2 Report. If that is not available and there is no time or money to go through the process, then calculating the Fabrication Capability Coefficient is a good ‘second-best’. Fabrication Yields The Fabrication Capability Coefficient (FCC) is computed from a fabricator’s electrical test data, their First Pass Read Article
    Calculating your PCB Complexity & First Pass Yields There are four things I know about PCB yields—mathematically! PCB yields are not normally distributed. They are what is called GAMMA Distributed. Defects that produce low yields may be systemic and repeatable, others may be just random—but you can test for this. You can predict yields if you take the time to collect the data. Yields are such wonderful things! I wonder why we don’t write about them more. They are the dividing phenomena that often Read Article
    Design Report Card One of my earlier BLOGs talked about PWB Cost Drivers. What is required for the PWB Value Delivery Chain is a method of predicting the cost of fabrication for the PCB substrate, as well as the cost of assembly and assembly testing. With these tools and the wiring density metrics, tradeoffs can be performed early in the product's life. Many call this Design for Manufacturing and Assembly, I call it the DFM Report Cards because that’s what its Read Article
    Newer PCB Materials If you are hearing about the newer, higher density HDI-PCBs used by Apple called SLP, and their processes like SAP, or uSAP or mSAP (Semi-Additive Processes) recently, these are the printed circuits that are getting down to 30 micron and 25 micron (1 mil) traces and spaces. HDI is now estimated to be over 250 million square meters produced per year-and still growing! But SAP is not NEW! We used it early in the 60’s and 70’s when we were making Read Article
    Learning Statistical Analysis I don’t have to tell anyone that times are tough! When they’re tough like this, you don’t like to waste what money you have earned—it came dearly! That’s when design choices come to mind. Any bad choices go to the bottom line; so what are some of the tools to help improve decision making? Statistical choices and probability come to mind. Design trade-offs have always been difficult to predict in printed circuits. Those uncontrolled factors can Read Article
    High Density Interconnects Download PDF